Issued Patents 2025
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431446 | Package structure | Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin, Chih-Hua Chen +4 more | 2025-09-30 |
| 12362274 | Package structure and method of forming the same | Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu +2 more | 2025-07-15 |
| 12334434 | Package structure and method of forming the same | Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu +2 more | 2025-06-17 |
| 12278208 | Method of fabricating semiconductor structure including a barrier structure in between a plurality of surface mount components and a wafer | Mao-Yen Chang, Chih-Wei Lin, Hao-Yi Tsai, Kuo Lung Pan, Chun-Cheng Lin +2 more | 2025-04-15 |
| 12222545 | Package and method of forming same | Chung-Ming Weng, Hung-Yi Kuo, Cheng-Chieh Hsieh, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2025-02-11 |
| 12205860 | Sensor packages | Tsung-Hsien Chiang, Yu-Chih Huang, Ting-Ting Kuo, Ban-Li Wu, Ying-Cheng Tseng +5 more | 2025-01-21 |