Issued Patents 2025
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12429645 | Optical film | Yu-Wei Tu, Kuo-Hsuan Yu | 2025-09-30 |
| 12431446 | Package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Hsiu-Jen Lin, Chih-Hua Chen +4 more | 2025-09-30 |
| 12397180 | Open type breathing-out particles capture and filtration device | Yu-Mei Kuo, Sheng-Hsiu Huang, Chih-Chieh Chen | 2025-08-26 |
| 12394938 | Force saving mechanism for circuit board installation | Chao-Jung Chen, Chia-Wei Huang | 2025-08-19 |
| 12394242 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Yu-Feng Chen, Hao-Yi Tsai +2 more | 2025-08-19 |
| 12394736 | Semiconductor package system and method | Hui-Min Huang, Tsai-Tsung Tsai, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2025-08-19 |
| 12378412 | Resin composition and article made therefrom | — | 2025-08-05 |
| 12382611 | Modular liquid cooling for multi-node computing systems | Chao-Jung Chen, Che-Hung Lin | 2025-08-05 |
| 12362270 | Package structure and method of fabricating the same | Kris Lipu Chuang, Tzu-Sung Huang, Yu-Fu Chen, Hsin-Yu Pan, Hao-Yi Tsai | 2025-07-15 |
| 12358194 | Molded semiconductor device and manufacturing method of molded semiconductor device | Sheng-Feng Weng, Ching-Hua Hsieh, Chung-Shi Liu, Sheng-Hsiang Chiu, Yao-Tong Lai +1 more | 2025-07-15 |
| 12354997 | Package structure and manufacturing method thereof | Sheng-Hsiang Chiu, Chia-Min Lin, Tzu-Ting Chou, Sheng-Feng Weng, Chao-Wei Li +1 more | 2025-07-08 |
| 12354929 | Package structure and manufacturing method thereof | Kai-Fung Chang, Sheng-Feng Weng, Ming-Yu Yen, Wei-Jhan Tsai, Chao-Wei Chiu +2 more | 2025-07-08 |
| 12334424 | Package structure and manufacturing method thereof | Kai-Ming Chiang, Wei-Jhan Tsai, Sheng-Feng Weng, Ching-Yao Lin, Ming-Yu Yen +2 more | 2025-06-17 |
| 12322640 | Semiconductor package and manufacturing method thereof | Sheng-Chieh Yang, Shing-Chao Chen, Ching-Hua Hsieh | 2025-06-03 |
| 12305073 | Restorable anti-glare film | TsunSheng Tao | 2025-05-20 |
| 12300659 | Aligning bumps in fan-out packaging process | Ying-Jui Huang, Chien Ling Hwang, Ching-Hua Hsieh, Chung-Shi Liu, Chen-Hua Yu | 2025-05-13 |
| 12300684 | Semiconductor packages | Sheng-Chieh Yang, Ching-Hua Hsieh, Yu-Hao Chen | 2025-05-13 |
| 12288729 | Integrated circuit package and method | Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai +2 more | 2025-04-29 |
| 12278208 | Method of fabricating semiconductor structure including a barrier structure in between a plurality of surface mount components and a wafer | Mao-Yen Chang, Hao-Yi Tsai, Kuo Lung Pan, Chun-Cheng Lin, Tin-Hao Kuo +2 more | 2025-04-15 |
| 12228980 | Mounting system for an electronic device | Chao-Jung Chen, Yu-Nien Huang, Ming-Lun Liu | 2025-02-18 |
| 12230549 | Three-dimensional integrated circuit structures and methods of forming the same | Chia-Min Lin, Ching-Hua Hsieh, Sheng-Hsiang Chiu, Sheng-Feng Weng, Yao-Tong Lai | 2025-02-18 |
| 12218082 | Package structure | Kai-Ming Chiang, Chao-Wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai +4 more | 2025-02-04 |