Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417969 | Semiconductor structure and circuit structure | Kuan-Lin Ho, Chin-Liang Chen, Pei-Rong Ni, Yu-Min Liang, Jiun Yi Wu | 2025-09-16 |
| 12358194 | Molded semiconductor device and manufacturing method of molded semiconductor device | Sheng-Feng Weng, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Sheng-Hsiang Chiu +1 more | 2025-07-15 |
| 12354997 | Package structure and manufacturing method thereof | Sheng-Hsiang Chiu, Tzu-Ting Chou, Sheng-Feng Weng, Chao-Wei Li, Chih-Wei Lin +1 more | 2025-07-08 |
| 12230549 | Three-dimensional integrated circuit structures and methods of forming the same | Ching-Hua Hsieh, Chih-Wei Lin, Sheng-Hsiang Chiu, Sheng-Feng Weng, Yao-Tong Lai | 2025-02-18 |
| 12218082 | Package structure | Kai-Ming Chiang, Chao-Wei Li, Wei-Lun Tsai, Yi-Da Tsai, Sheng-Feng Weng +4 more | 2025-02-04 |