Issued Patents 2025
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12358194 | Molded semiconductor device and manufacturing method of molded semiconductor device | Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Sheng-Hsiang Chiu, Yao-Tong Lai +1 more | 2025-07-15 |
| 12354929 | Package structure and manufacturing method thereof | Kai-Fung Chang, Ming-Yu Yen, Wei-Jhan Tsai, Chao-Wei Chiu, Chao-Wei Li +2 more | 2025-07-08 |
| 12354997 | Package structure and manufacturing method thereof | Sheng-Hsiang Chiu, Chia-Min Lin, Tzu-Ting Chou, Chao-Wei Li, Chih-Wei Lin +1 more | 2025-07-08 |
| 12334424 | Package structure and manufacturing method thereof | Kai-Ming Chiang, Wei-Jhan Tsai, Ching-Yao Lin, Ming-Yu Yen, Kai-Fung Chang +2 more | 2025-06-17 |
| 12230549 | Three-dimensional integrated circuit structures and methods of forming the same | Chia-Min Lin, Ching-Hua Hsieh, Chih-Wei Lin, Sheng-Hsiang Chiu, Yao-Tong Lai | 2025-02-18 |
| 12218082 | Package structure | Kai-Ming Chiang, Chao-Wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai +4 more | 2025-02-04 |