Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354929 | Package structure and manufacturing method thereof | Sheng-Feng Weng, Ming-Yu Yen, Wei-Jhan Tsai, Chao-Wei Chiu, Chao-Wei Li +2 more | 2025-07-08 |
| 12334424 | Package structure and manufacturing method thereof | Kai-Ming Chiang, Wei-Jhan Tsai, Sheng-Feng Weng, Ching-Yao Lin, Ming-Yu Yen +2 more | 2025-06-17 |