Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334424 | Package structure and manufacturing method thereof | Wei-Jhan Tsai, Sheng-Feng Weng, Ching-Yao Lin, Ming-Yu Yen, Kai-Fung Chang +2 more | 2025-06-17 |
| 12218082 | Package structure | Chao-Wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng +4 more | 2025-02-04 |