Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368086 | Package structure having thermoelectric cooler | Chao-Wei Li, Hsiu-Jen Lin, Ching-Hua Hsieh | 2025-07-22 |
| 12354929 | Package structure and manufacturing method thereof | Kai-Fung Chang, Sheng-Feng Weng, Ming-Yu Yen, Wei-Jhan Tsai, Chao-Wei Li +2 more | 2025-07-08 |
| 12266559 | Method of manufacturing semiconductor package, method of handling wafer, and method of handling workpiece | Cheng-Shiuan Wong, Chih-Chiang Tsao, Hao-Jan Pei, Wei-Yu Chen, Hsiu-Jen Lin +2 more | 2025-04-01 |