Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417927 | Semiconductor device and method of manufacture | Wei-Yu Chen, Hao-Jan Pei, Hsuan-Ting Kuo, Jen-Jui Yu, Philip Yu-Shuan Chung +3 more | 2025-09-16 |
| 12266559 | Method of manufacturing semiconductor package, method of handling wafer, and method of handling workpiece | Cheng-Shiuan Wong, Chao-Wei Chiu, Hao-Jan Pei, Wei-Yu Chen, Hsiu-Jen Lin +2 more | 2025-04-01 |
| 12261088 | Package structure and method of forming the same | Jen-Jui Yu, Hao-Jan Pei, Cheng-Ting Chen, Hsiu-Jen Lin, Ching-Hua Hsieh | 2025-03-25 |
| 12230597 | Package structure with warpage-control element | Hao-Jan Pei, Wei-Yu Chen, Hsiu-Jen Lin, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2025-02-18 |