Issued Patents 2025
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431446 | Package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Chih-Hua Chen +4 more | 2025-09-30 |
| 12417927 | Semiconductor device and method of manufacture | Wei-Yu Chen, Hao-Jan Pei, Hsuan-Ting Kuo, Chih-Chiang Tsao, Jen-Jui Yu +3 more | 2025-09-16 |
| 12406961 | Integrated circuit package and method | Chung-Shi Liu, Mao-Yen Chang, Yu-Chia Lai, Kuo Lung Pan, Hao-Yi Tsai +4 more | 2025-09-02 |
| 12388041 | Semiconductor package | Kris Lipu Chuang, Tzu-Sung Huang, Hsin-Yu Pan | 2025-08-12 |
| 12388060 | Integrated fan-out packages and methods of forming the same | Chen-Hua Yu, Kuo Lung Pan, Ting Hao Kuo, Hao-Yi Tsai, Hao-Jan Pei +1 more | 2025-08-12 |
| 12374627 | Method of fabricating semiconductor structure | Tzu-Sung Huang, Cheng-Chieh Hsieh, Hui-Jung Tsai, Hung-Yi Kuo, Hao-Yi Tsai +4 more | 2025-07-29 |
| 12368086 | Package structure having thermoelectric cooler | Chao-Wei Chiu, Chao-Wei Li, Ching-Hua Hsieh | 2025-07-22 |
| 12368053 | Method for laser drilling process for an integrated circuit package | Chia-Shen Cheng, Chia-Lun Chang, Hao-Jan Pei, Ching-Hua Hsieh | 2025-07-22 |
| 12368149 | Methods of forming semiconductor packages | Hao-Jan Pei, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng, Kuei-Wei Huang +3 more | 2025-07-22 |
| 12300652 | Substrate and package structure | Wei-Hung Lin, Ming-Da Cheng, Yu-Min Liang, Chen-Shien Chen, Chung-Shi Liu | 2025-05-13 |
| 12266559 | Method of manufacturing semiconductor package, method of handling wafer, and method of handling workpiece | Cheng-Shiuan Wong, Chih-Chiang Tsao, Chao-Wei Chiu, Hao-Jan Pei, Wei-Yu Chen +2 more | 2025-04-01 |
| 12266673 | Semiconductor package and method of forming the same | Chia-Lun Chang, Ching-Hua Hsieh, Chung-Hao Tsai, Chung-Shi Liu, Chuei-Tang Wang | 2025-04-01 |
| 12261088 | Package structure and method of forming the same | Jen-Jui Yu, Hao-Jan Pei, Cheng-Ting Chen, Chih-Chiang Tsao, Ching-Hua Hsieh | 2025-03-25 |
| 12261092 | Semiconductor package and manufacturing method thereof | Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Ban-Li Wu, Teng-Yuan Lo +1 more | 2025-03-25 |
| 12230597 | Package structure with warpage-control element | Hao-Jan Pei, Chih-Chiang Tsao, Wei-Yu Chen, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2025-02-18 |