Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368053 | Method for laser drilling process for an integrated circuit package | Chia-Lun Chang, Hao-Jan Pei, Hsiu-Jen Lin, Ching-Hua Hsieh | 2025-07-22 |
| 12368149 | Methods of forming semiconductor packages | Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Kuei-Wei Huang +3 more | 2025-07-22 |
| 12266559 | Method of manufacturing semiconductor package, method of handling wafer, and method of handling workpiece | Cheng-Shiuan Wong, Chih-Chiang Tsao, Chao-Wei Chiu, Hao-Jan Pei, Wei-Yu Chen +2 more | 2025-04-01 |