Partial year: Data through Q3 2025 (Sept 30). Full-year totals not yet available.
KH

Kuei-Wei Huang

TSMC: 1 patents #2,025 of 3,957Top 55%
Overall (2025): #311,761 of 469,880Top 70%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12368149 Methods of forming semiconductor packages Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng +3 more 2025-07-22