Issued Patents 2025
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417927 | Semiconductor device and method of manufacture | Wei-Yu Chen, Hsuan-Ting Kuo, Chih-Chiang Tsao, Jen-Jui Yu, Philip Yu-Shuan Chung +3 more | 2025-09-16 |
| 12388060 | Integrated fan-out packages and methods of forming the same | Chen-Hua Yu, Kuo Lung Pan, Ting Hao Kuo, Hao-Yi Tsai, Hsiu-Jen Lin +1 more | 2025-08-12 |
| 12368149 | Methods of forming semiconductor packages | Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng, Kuei-Wei Huang +3 more | 2025-07-22 |
| 12368053 | Method for laser drilling process for an integrated circuit package | Chia-Shen Cheng, Chia-Lun Chang, Hsiu-Jen Lin, Ching-Hua Hsieh | 2025-07-22 |
| 12266559 | Method of manufacturing semiconductor package, method of handling wafer, and method of handling workpiece | Cheng-Shiuan Wong, Chih-Chiang Tsao, Chao-Wei Chiu, Wei-Yu Chen, Hsiu-Jen Lin +2 more | 2025-04-01 |
| 12261088 | Package structure and method of forming the same | Jen-Jui Yu, Cheng-Ting Chen, Chih-Chiang Tsao, Hsiu-Jen Lin, Ching-Hua Hsieh | 2025-03-25 |
| 12230597 | Package structure with warpage-control element | Chih-Chiang Tsao, Wei-Yu Chen, Hsiu-Jen Lin, Ming-Da Cheng, Ching-Hua Hsieh +1 more | 2025-02-18 |