Issued Patents 2025
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412817 | Integrated circuit package and method | Chi-Hui Lai, Shu-Rong Chun, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2025-09-09 |
| 12406961 | Integrated circuit package and method | Chung-Shi Liu, Mao-Yen Chang, Yu-Chia Lai, Hao-Yi Tsai, Ching-Hua Hsieh +4 more | 2025-09-02 |
| 12388060 | Integrated fan-out packages and methods of forming the same | Chen-Hua Yu, Ting Hao Kuo, Hao-Yi Tsai, Hsiu-Jen Lin, Hao-Jan Pei +1 more | 2025-08-12 |
| 12374592 | Semiconductor device and manufacturing method thereof | Cheng-Chieh Wu, Ting Hao Kuo, Po-Yuan Teng, Yu-Chia Lai, Shu-Rong Chun +7 more | 2025-07-29 |
| 12322706 | Chip package and method of forming the same | Hao-Yi Tsai, Tin-Hao Kuo | 2025-06-03 |
| 12300571 | Integrated circuit package and method | Shu-Rong Chun, Pei-Hsuan Lee, Chien Ling Hwang, Yu-Chia Lai, Tin-Hao Kuo +2 more | 2025-05-13 |
| 12278208 | Method of fabricating semiconductor structure including a barrier structure in between a plurality of surface mount components and a wafer | Mao-Yen Chang, Chih-Wei Lin, Hao-Yi Tsai, Chun-Cheng Lin, Tin-Hao Kuo +2 more | 2025-04-15 |
| 12255174 | Bonding passive devices on active dies to form 3D packages | Chen-Hua Yu, Shu-Rong Chun, Chi-Hui Lai, Tin-Hao Kuo, Hao-Yi Tsai +1 more | 2025-03-18 |
| 12199051 | Integrated circuit structure and method | Chen-Hua Yu, Tin-Hao Kuo, Hao-Yi Tsai | 2025-01-14 |