Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374595 | Package system and manufacturing method thereof | Ching-Hua Hsieh, Chien Ling Hwang | 2025-07-29 |
| 12300571 | Integrated circuit package and method | Shu-Rong Chun, Kuo Lung Pan, Chien Ling Hwang, Yu-Chia Lai, Tin-Hao Kuo +2 more | 2025-05-13 |
| 12243218 | Method and system for scanning wafer | Chien-Hsiang Huang, Kuang-Shing Chen, Kuan-Hsin Chen, Chun-Chieh Chin | 2025-03-04 |