Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374595 | Package system and manufacturing method thereof | Pei-Hsuan Lee, Ching-Hua Hsieh | 2025-07-29 |
| 12300659 | Aligning bumps in fan-out packaging process | Ying-Jui Huang, Chih-Wei Lin, Ching-Hua Hsieh, Chung-Shi Liu, Chen-Hua Yu | 2025-05-13 |
| 12300571 | Integrated circuit package and method | Shu-Rong Chun, Kuo Lung Pan, Pei-Hsuan Lee, Yu-Chia Lai, Tin-Hao Kuo +2 more | 2025-05-13 |