Issued Patents 2025
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406961 | Integrated circuit package and method | Chung-Shi Liu, Mao-Yen Chang, Kuo Lung Pan, Hao-Yi Tsai, Ching-Hua Hsieh +4 more | 2025-09-02 |
| 12374592 | Semiconductor device and manufacturing method thereof | Cheng-Chieh Wu, Ting Hao Kuo, Kuo Lung Pan, Po-Yuan Teng, Shu-Rong Chun +7 more | 2025-07-29 |
| 12368141 | IPD modules with flexible connection scheme in packaging | Cheng-Chieh Hsieh, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu | 2025-07-22 |
| 12300618 | Semiconductor device having a heat dissipation structure connected chip package | Po-Yuan Teng, Hung-Yi Kuo, Hao-Yi Tsai, Tin-Hao Kuo, Shih-Wei Chen | 2025-05-13 |
| 12300571 | Integrated circuit package and method | Shu-Rong Chun, Kuo Lung Pan, Pei-Hsuan Lee, Chien Ling Hwang, Tin-Hao Kuo +2 more | 2025-05-13 |
| 12278199 | Conductive bump of a semiconductor device and fabricating method thereof cross reference to related applications | Chang-Pin Huang, Tung-Liang Shao, Hsien-Ming Tu, Ching-Jung Yang | 2025-04-15 |
| 12278208 | Method of fabricating semiconductor structure including a barrier structure in between a plurality of surface mount components and a wafer | Mao-Yen Chang, Chih-Wei Lin, Hao-Yi Tsai, Kuo Lung Pan, Chun-Cheng Lin +2 more | 2025-04-15 |
| 12205923 | Semiconductor device, circuit board structure and manufacturing method thereof | Tin-Hao Kuo, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Po-Yuan Teng | 2025-01-21 |