Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406961 | Integrated circuit package and method | Chung-Shi Liu, Mao-Yen Chang, Yu-Chia Lai, Kuo Lung Pan, Hao-Yi Tsai +4 more | 2025-09-02 |
| 12374592 | Semiconductor device and manufacturing method thereof | Cheng-Chieh Wu, Ting Hao Kuo, Kuo Lung Pan, Yu-Chia Lai, Shu-Rong Chun +7 more | 2025-07-29 |
| 12300618 | Semiconductor device having a heat dissipation structure connected chip package | Hung-Yi Kuo, Hao-Yi Tsai, Tin-Hao Kuo, Yu-Chia Lai, Shih-Wei Chen | 2025-05-13 |
| 12205923 | Semiconductor device, circuit board structure and manufacturing method thereof | Tin-Hao Kuo, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Yu-Chia Lai | 2025-01-21 |