Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381163 | Semiconductor package and manufacturing method thereof | Yu-Chih Huang, Chih-Hao Chang, Po-Chun Lin, Chun-Ti Lu, Zheng-Gang Tsai +3 more | 2025-08-05 |
| 12300618 | Semiconductor device having a heat dissipation structure connected chip package | Po-Yuan Teng, Hung-Yi Kuo, Hao-Yi Tsai, Tin-Hao Kuo, Yu-Chia Lai | 2025-05-13 |
| 12255196 | Semiconductor package with thermal relaxation block and manufacturing method thereof | Chih-Hua Chen, Hsin-Yu Pan, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo | 2025-03-18 |