PL

Po-Chun Lin

TSMC: 3 patents #974 of 3,957Top 25%
Overall (2025): #50,004 of 469,880Top 15%
3
Patents 2025

Issued Patents 2025

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
12381163 Semiconductor package and manufacturing method thereof Yu-Chih Huang, Chih-Hao Chang, Chun-Ti Lu, Zheng-Gang Tsai, Shih-Wei Chen +3 more 2025-08-05
12362274 Package structure and method of forming the same Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu +2 more 2025-07-15
12334434 Package structure and method of forming the same Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu +2 more 2025-06-17