Issued Patents 2025
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406941 | Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the same | Yi-Che Chiang, Chien-Hsun Chen, Tuan-Yu Hung, Hsin-Yu Pan, Wei-Kang Hsieh +8 more | 2025-09-02 |
| 12362274 | Package structure and method of forming the same | Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu +2 more | 2025-07-15 |
| 12362329 | Method of fabricating semiconductor package | Hao-Yi Tsai, Cheng-Chieh Hsieh, Hui-Chun Chiang, Tzu-Sung Huang, Ming Hung Tseng +4 more | 2025-07-15 |
| 12334434 | Package structure and method of forming the same | Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu +2 more | 2025-06-17 |
| 12266639 | Method of fabricating semiconductor package | Hao-Yi Tsai, Cheng-Chieh Hsieh, Hui-Chun Chiang, Tzu-Sung Huang, Ming Hung Tseng +4 more | 2025-04-01 |
| 12261126 | Semiconductor package | Hsien-Ming Tu, Hao-Yi Tsai, Tin-Hao Kuo | 2025-03-25 |
| 12205860 | Sensor packages | Yu-Chih Huang, Ting-Ting Kuo, Chih-Hsuan Tai, Ban-Li Wu, Ying-Cheng Tseng +5 more | 2025-01-21 |