Issued Patents 2025
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12418982 | Laminated structure with pads and manufacturing method thereof | Hao-Cheng Hou, Tsung-Ding Wang, Jung Wei Cheng, Chien-Hsun Lee | 2025-09-16 |
| 12406941 | Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the same | Yi-Che Chiang, Tuan-Yu Hung, Hsin-Yu Pan, Wei-Kang Hsieh, Tsung-Hsien Chiang +8 more | 2025-09-02 |
| 12354924 | Integrated circuit package and method | Yu-Ling Tsai, Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2025-07-08 |
| 12280326 | System for separation of gas and solid | Kuen-Yi Wu | 2025-04-22 |
| 12249564 | Package structure, RDL structure comprising redistribution layer having ground plates and signal lines | Jiun Yi Wu, Shou-Yi Wang | 2025-03-11 |
| 12191251 | Semiconductor device and method of manufacture | Jiun Yi Wu, Chen-Hua Yu | 2025-01-07 |