Issued Patents 2025
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417968 | Package structure and forming method thereof | Chin-Liang Chen, Chi-Yang Yu, Yu-Min Liang, Hao-Cheng Hou, Jung Wei Cheng | 2025-09-16 |
| 12418982 | Laminated structure with pads and manufacturing method thereof | Hao-Cheng Hou, Jung Wei Cheng, Chien-Hsun Chen, Chien-Hsun Lee | 2025-09-16 |
| 12412846 | Semiconductor package and methods of fabricating a semiconductor package | Chin-Liang Chen, Hao-Cheng Hou, Yu-Min Liang, Jung Wei Cheng | 2025-09-09 |
| 12362321 | Semiconductor package | Yen-Fu Su, Hao-Cheng Hou, Jung Wei Cheng, Chien-Hsun Lee, Hsin-Yu Pan | 2025-07-15 |
| 12345740 | Probe card substrate, substrate structure and method of fabricating the same | Wei-Yu Chen, Yu-Min Liang, Hao-Cheng Hou, Chien-Hsun Lee, Chung-Shi Liu +1 more | 2025-07-01 |
| 12218021 | Semiconductor packages and methods of forming the same | Jung Wei Cheng, Jiun Yi Wu, Hsin-Yu Pan, Yu-Min Liang, Wei-Yu Chen | 2025-02-04 |
| 12199065 | Multi-die package structures including redistribution layers | Chen-Hua Yu, Kuo-Chung Yee, Chien-Hsun Lee | 2025-01-14 |