Issued Patents 2025
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12418982 | Laminated structure with pads and manufacturing method thereof | Hao-Cheng Hou, Tsung-Ding Wang, Chien-Hsun Chen, Chien-Hsun Lee | 2025-09-16 |
| 12417968 | Package structure and forming method thereof | Chin-Liang Chen, Chi-Yang Yu, Yu-Min Liang, Hao-Cheng Hou, Tsung-Ding Wang | 2025-09-16 |
| 12412846 | Semiconductor package and methods of fabricating a semiconductor package | Chin-Liang Chen, Hao-Cheng Hou, Yu-Min Liang, Tsung-Ding Wang | 2025-09-09 |
| 12368112 | Electronic component and manufacturing method thereof | Chi-Yang Yu, Yu-Min Liang, Chien-Hsun Lee | 2025-07-22 |
| 12362321 | Semiconductor package | Tsung-Ding Wang, Yen-Fu Su, Hao-Cheng Hou, Chien-Hsun Lee, Hsin-Yu Pan | 2025-07-15 |
| 12345740 | Probe card substrate, substrate structure and method of fabricating the same | Wei-Yu Chen, Yu-Min Liang, Hao-Cheng Hou, Tsung-Ding Wang, Chien-Hsun Lee +1 more | 2025-07-01 |
| 12249587 | Semiconductor structure and forming method thereof | Jiun Yi Wu, Chen-Hua Yu, Yu-Min Liang | 2025-03-11 |
| 12230589 | Semiconductor package | Chi-Yang Yu, Yu-Min Liang, Jiun Yi Wu, Yen-Fu Su, Chien-Chang Lin +1 more | 2025-02-18 |
| 12218021 | Semiconductor packages and methods of forming the same | Jiun Yi Wu, Hsin-Yu Pan, Tsung-Ding Wang, Yu-Min Liang, Wei-Yu Chen | 2025-02-04 |