Issued Patents 2025
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424562 | Three-dimensional (3D) package | Wei-Yu Chen, Chun-Chih Chuang, Kuan-Lin Ho, Jiun Yi Wu | 2025-09-23 |
| 12417969 | Semiconductor structure and circuit structure | Kuan-Lin Ho, Chin-Liang Chen, Pei-Rong Ni, Chia-Min Lin, Jiun Yi Wu | 2025-09-16 |
| 12417968 | Package structure and forming method thereof | Chin-Liang Chen, Chi-Yang Yu, Hao-Cheng Hou, Jung Wei Cheng, Tsung-Ding Wang | 2025-09-16 |
| 12412846 | Semiconductor package and methods of fabricating a semiconductor package | Chin-Liang Chen, Hao-Cheng Hou, Jung Wei Cheng, Tsung-Ding Wang | 2025-09-09 |
| 12412862 | Package structure and manufacturing method thereof | Chi-Yang Yu, Nien-Fang Wu, Hai-Ming Chen, Jiun Yi Wu | 2025-09-09 |
| 12368112 | Electronic component and manufacturing method thereof | Chi-Yang Yu, Jung Wei Cheng, Chien-Hsun Lee | 2025-07-22 |
| 12352313 | Ball spline with lubrication passage | Hao-Ti Chuang, Shang-Hua Tsai | 2025-07-08 |
| 12345740 | Probe card substrate, substrate structure and method of fabricating the same | Wei-Yu Chen, Hao-Cheng Hou, Tsung-Ding Wang, Chien-Hsun Lee, Chung-Shi Liu +1 more | 2025-07-01 |
| 12347802 | Die corner removal for underfill crack suppression in semiconductor die packaging | Wei-Yu Chen, Chi-Yang Yu, Kuan-Lin Ho, Chin-Liang Chen, Jiun Yi Wu | 2025-07-01 |
| 12300652 | Substrate and package structure | Wei-Hung Lin, Hsiu-Jen Lin, Ming-Da Cheng, Chen-Shien Chen, Chung-Shi Liu | 2025-05-13 |
| 12249587 | Semiconductor structure and forming method thereof | Jiun Yi Wu, Chen-Hua Yu, Jung Wei Cheng | 2025-03-11 |
| 12230589 | Semiconductor package | Chi-Yang Yu, Jung Wei Cheng, Jiun Yi Wu, Yen-Fu Su, Chien-Chang Lin +1 more | 2025-02-18 |
| 12218020 | Semiconductor packages | Jiun Yi Wu, Chen-Hua Yu, Chung-Shi Liu | 2025-02-04 |
| 12218021 | Semiconductor packages and methods of forming the same | Jung Wei Cheng, Jiun Yi Wu, Hsin-Yu Pan, Tsung-Ding Wang, Wei-Yu Chen | 2025-02-04 |