Issued Patents 2025
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388003 | Chip package structure with metal-containing layer | Yu-Huan Chen, Kuo-Ching Hsu | 2025-08-12 |
| 12376317 | Semiconductor device structure with magnetic element | Chi-Cheng Chen, Wei-Li Huang, Chien-Chih Kuo, Hon-Lin Huang, Chin-Yu Ku | 2025-07-29 |
| 12368120 | Semiconductor device and method | Ting-Li Yang, Po-Hao Tsai, Chien-Chen Li, Ming-Da Cheng | 2025-07-22 |
| 12347722 | Semiconductor device structure with a protection cap at an end portion of a conductive line | Ting-Li Yang, Wei-Li Huang, Sheng-Pin Yang, Chi-Cheng Chen, Hon-Lin Huang +1 more | 2025-07-01 |
| 12334476 | Semiconductor device with discrete blocks | Ching-Wen Hsiao, Wei Sen Chang, Shou-Cheng Hu | 2025-06-17 |
| 12334489 | Lthc as charging barrier in info package formation | Yi-Jen Lai, Chung-Yi Lin, Hsi-Kuei Cheng, Kuo-Chio Liu | 2025-06-17 |
| 12327782 | Systems for semiconductor package mounting with improved co-planarity | Wen-Yi Lin, Kuang-Chun Lee, Chien-Chen Li | 2025-06-10 |
| 12300644 | Die bonding pads and methods of forming the same | Wen-Hsiung Lu, Ming-Da Cheng, Chia-Li Lin, Yu-Chih Huang | 2025-05-13 |
| 12300652 | Substrate and package structure | Wei-Hung Lin, Hsiu-Jen Lin, Ming-Da Cheng, Yu-Min Liang, Chung-Shi Liu | 2025-05-13 |
| 12293951 | Semiconductor package structure having ring portion with recess for adhesive | Hui-Ting Lin, Chin-Fu Kao | 2025-05-06 |