Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412857 | Hybrid micro-bump integration with redistribution layer | Ting-Li Yang, Po-Hao Tsai, Yi-Wen Wu, Hao-Chun Liu | 2025-09-09 |
| 12347722 | Semiconductor device structure with a protection cap at an end portion of a conductive line | Ting-Li Yang, Wei-Li Huang, Chi-Cheng Chen, Hon-Lin Huang, Chin-Yu Ku +1 more | 2025-07-01 |