Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431452 | Semiconductor package including corner bumps coaxially offset from the pads and non-corner bumps coaxially aligned with the pads | Chiang-Jui Chu, Ching-Wen Hsiao | 2025-09-30 |
| 12412857 | Hybrid micro-bump integration with redistribution layer | Ting-Li Yang, Po-Hao Tsai, Yi-Wen Wu, Sheng-Pin Yang | 2025-09-09 |
| 12394096 | Error correction method and device for line structured light 3D camera, computer device and computer-readable storage medium | Zhipeng WEI, Xuyang He, Yangyang Guo, Weikang Wu, Biao Xia +1 more | 2025-08-19 |
| 12272664 | Semiconductor packages having conductive pillars with inclined surfaces | Chiang-Jui Chu, Ching-Wen Hsiao, Ming-Da Cheng, Young-Hwa Wu, Tao-Sheng Chang | 2025-04-08 |