Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412857 | Hybrid micro-bump integration with redistribution layer | Po-Hao Tsai, Yi-Wen Wu, Sheng-Pin Yang, Hao-Chun Liu | 2025-09-09 |
| 12368120 | Semiconductor device and method | Chen-Shien Chen, Po-Hao Tsai, Chien-Chen Li, Ming-Da Cheng | 2025-07-22 |
| 12347722 | Semiconductor device structure with a protection cap at an end portion of a conductive line | Wei-Li Huang, Sheng-Pin Yang, Chi-Cheng Chen, Hon-Lin Huang, Chin-Yu Ku +1 more | 2025-07-01 |
| 12266593 | Method of forming semiconductor device having at least one via including concave portions on sidewall | Wen-Hsiung Lu, Jhao-Yi Wang, Fu Wei Liu, Chin-Yu Ku | 2025-04-01 |
| 12243837 | Semiconductor device and method | Po-Hao Tsai, Ming-Da Cheng, Yung-Han Chuang, Hsueh-Sheng Wang | 2025-03-04 |