Issued Patents 2025
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431365 | Bump structure and method of making the same | Ming-Da Cheng, Su-Fei Lin, Hsu-Lun Liu, Chien-Pin Chan, Yung-Sheng Lin | 2025-09-30 |
| 12300644 | Die bonding pads and methods of forming the same | Ming-Da Cheng, Chia-Li Lin, Yu-Chih Huang, Chen-Shien Chen | 2025-05-13 |
| 12300580 | Semiconductor device and method | Hsu-Lun Liu, Ming-Da Cheng, Chen-En Yen, Cheng-Lung Yang, Kuanchih Huang | 2025-05-13 |
| 12266593 | Method of forming semiconductor device having at least one via including concave portions on sidewall | Ting-Li Yang, Jhao-Yi Wang, Fu Wei Liu, Chin-Yu Ku | 2025-04-01 |
| 12255166 | Semiconductor package structure comprising via structure and redistribution layer structure | Neng-Chieh CHANG, Po-Hao Tsai, Ming-Da Cheng, Hsu-Lun Liu | 2025-03-18 |
| 12209013 | Arched membrane structure for MEMS device | Jhao-Yi Wang, Chin-Yu Ku, Lung-Kai Mao, Ming-Da Cheng | 2025-01-28 |