NC

Neng-Chieh CHANG

TSMC: 1 patents #2,025 of 3,957Top 55%
📍 Tainan, TW: #286 of 764 inventorsTop 40%
Overall (2025): #267,913 of 469,880Top 60%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12255166 Semiconductor package structure comprising via structure and redistribution layer structure Po-Hao Tsai, Ming-Da Cheng, Wen-Hsiung Lu, Hsu-Lun Liu 2025-03-18