Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431365 | Bump structure and method of making the same | Wen-Hsiung Lu, Ming-Da Cheng, Su-Fei Lin, Chien-Pin Chan, Yung-Sheng Lin | 2025-09-30 |
| 12300580 | Semiconductor device and method | Wen-Hsiung Lu, Ming-Da Cheng, Chen-En Yen, Cheng-Lung Yang, Kuanchih Huang | 2025-05-13 |
| 12255166 | Semiconductor package structure comprising via structure and redistribution layer structure | Neng-Chieh CHANG, Po-Hao Tsai, Ming-Da Cheng, Wen-Hsiung Lu | 2025-03-18 |