Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431365 | Bump structure and method of making the same | Wen-Hsiung Lu, Ming-Da Cheng, Su-Fei Lin, Hsu-Lun Liu, Chien-Pin Chan | 2025-09-30 |
| 12412858 | Semiconductor device structure with conductive bumps | Hui-Min Huang, Ming-Da Cheng, Wei-Hung Lin, Chang-Jung Hsueh, Kai Jun Zhan | 2025-09-09 |
| 12333314 | Systems and methods for configuration of a workspace based on short-range wireless location mapping in heterogeneous computing platforms | Daniel L. Hamlin, Todd Erick Swierk, Srikanth Kondapi, Hariprasad Janardana Iyer | 2025-06-17 |