Issued Patents 2025
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12419167 | Display device | Li-Wei Sung, Cheng-Tso Chen, Chia-Min Yeh | 2025-09-16 |
| 12411384 | Electronic device | Shu-Han Yang, Chia-Min Yeh | 2025-09-09 |
| 12412858 | Semiconductor device structure with conductive bumps | Ming-Da Cheng, Wei-Hung Lin, Chang-Jung Hsueh, Kai Jun Zhan, Yung-Sheng Lin | 2025-09-09 |
| 12394736 | Semiconductor package system and method | Chih-Wei Lin, Tsai-Tsung Tsai, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2025-08-19 |
| 12381171 | Semiconductor die including stress-resistant bonding structures and methods of forming the same | Wei-Hung Lin, Kai Jun Zhan, Chang-Jung Hsueh, Wan-Yu Chiang, Ming-Da Cheng | 2025-08-05 |
| 12237320 | Package structure and method of forming the same | Wei-Hung Lin, Chang-Jung Hsueh, Wan-Yu Chiang, Ming-Da Cheng, Mirng-Ji Lii | 2025-02-25 |