Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381171 | Semiconductor die including stress-resistant bonding structures and methods of forming the same | Hui-Min Huang, Wei-Hung Lin, Kai Jun Zhan, Chang-Jung Hsueh, Ming-Da Cheng | 2025-08-05 |
| 12288730 | Semiconductor device, semiconductor package, and methods of manufacturing the same | Chang-Jung Hsueh, Cheng-Nan Lin, Wei-Hung Lin, Ching-Wen Hsiao, Ming-Da Cheng | 2025-04-29 |
| 12237320 | Package structure and method of forming the same | Wei-Hung Lin, Hui-Min Huang, Chang-Jung Hsueh, Ming-Da Cheng, Mirng-Ji Lii | 2025-02-25 |