Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412858 | Semiconductor device structure with conductive bumps | Hui-Min Huang, Ming-Da Cheng, Wei-Hung Lin, Chang-Jung Hsueh, Yung-Sheng Lin | 2025-09-09 |
| 12381171 | Semiconductor die including stress-resistant bonding structures and methods of forming the same | Hui-Min Huang, Wei-Hung Lin, Chang-Jung Hsueh, Wan-Yu Chiang, Ming-Da Cheng | 2025-08-05 |