Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412858 | Semiconductor device structure with conductive bumps | Hui-Min Huang, Ming-Da Cheng, Wei-Hung Lin, Kai Jun Zhan, Yung-Sheng Lin | 2025-09-09 |
| 12381171 | Semiconductor die including stress-resistant bonding structures and methods of forming the same | Hui-Min Huang, Wei-Hung Lin, Kai Jun Zhan, Wan-Yu Chiang, Ming-Da Cheng | 2025-08-05 |
| 12288730 | Semiconductor device, semiconductor package, and methods of manufacturing the same | Cheng-Nan Lin, Wan-Yu Chiang, Wei-Hung Lin, Ching-Wen Hsiao, Ming-Da Cheng | 2025-04-29 |
| 12237320 | Package structure and method of forming the same | Wei-Hung Lin, Hui-Min Huang, Wan-Yu Chiang, Ming-Da Cheng, Mirng-Ji Lii | 2025-02-25 |