Issued Patents 2025
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431452 | Semiconductor package including corner bumps coaxially offset from the pads and non-corner bumps coaxially aligned with the pads | Chiang-Jui Chu, Hao-Chun Liu | 2025-09-30 |
| 12422293 | Server and air duct sensing method | Po-Sheng Su, Hsien-Yu Wang, Tzu-Shun Wang | 2025-09-23 |
| 12417992 | Chip structure with conductive pillar and method for forming the same | Shan-Yu Huang, Ming-Da Cheng, Hsiao-Wen Chung, LI-CHUN HUNG, Yuan-Yao Chang +1 more | 2025-09-16 |
| 12334476 | Semiconductor device with discrete blocks | Chen-Shien Chen, Wei Sen Chang, Shou-Cheng Hu | 2025-06-17 |
| 12288730 | Semiconductor device, semiconductor package, and methods of manufacturing the same | Chang-Jung Hsueh, Cheng-Nan Lin, Wan-Yu Chiang, Wei-Hung Lin, Ming-Da Cheng | 2025-04-29 |
| 12272664 | Semiconductor packages having conductive pillars with inclined surfaces | Chiang-Jui Chu, Hao-Chun Liu, Ming-Da Cheng, Young-Hwa Wu, Tao-Sheng Chang | 2025-04-08 |