Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431452 | Semiconductor package including corner bumps coaxially offset from the pads and non-corner bumps coaxially aligned with the pads | Ching-Wen Hsiao, Hao-Chun Liu | 2025-09-30 |
| 12272664 | Semiconductor packages having conductive pillars with inclined surfaces | Ching-Wen Hsiao, Hao-Chun Liu, Ming-Da Cheng, Young-Hwa Wu, Tao-Sheng Chang | 2025-04-08 |