Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12272664 | Semiconductor packages having conductive pillars with inclined surfaces | Chiang-Jui Chu, Ching-Wen Hsiao, Hao-Chun Liu, Ming-Da Cheng, Young-Hwa Wu | 2025-04-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12272664 | Semiconductor packages having conductive pillars with inclined surfaces | Chiang-Jui Chu, Ching-Wen Hsiao, Hao-Chun Liu, Ming-Da Cheng, Young-Hwa Wu | 2025-04-08 |