Issued Patents 2025
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417992 | Chip structure with conductive pillar and method for forming the same | Shan-Yu Huang, Ming-Da Cheng, Hsiao-Wen Chung, Ching-Wen Hsiao, Yuan-Yao Chang +1 more | 2025-09-16 |
| 12376399 | Sensor package structure | Chia-Shuai Chang, CHIEN-CHEN LEE, Chien-Yuan Wang, Yi-Chih Lee | 2025-07-29 |
| 12356742 | Chip packaging structure and chip packaging method | You-Wei Chang, CHIEN-CHEN LEE | 2025-07-08 |
| 12224299 | Sensor package structure | CHIEN-CHEN LEE, Chien-Yuan Wang | 2025-02-11 |
| 12224359 | Sensor package structure having solder mask frame | Fu-Chou Liu, Jui-Hung Hsu, Yu-Chiang Peng, CHIEN-CHEN LEE, Ya-Han Chang | 2025-02-11 |
| 12189152 | Sensor lens assembly | Chia-Shuai Chang, CHIEN-CHEN LEE | 2025-01-07 |