Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12224359 | Sensor package structure having solder mask frame | Fu-Chou Liu, Yu-Chiang Peng, CHIEN-CHEN LEE, Ya-Han Chang, LI-CHUN HUNG | 2025-02-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12224359 | Sensor package structure having solder mask frame | Fu-Chou Liu, Yu-Chiang Peng, CHIEN-CHEN LEE, Ya-Han Chang, LI-CHUN HUNG | 2025-02-11 |