Partial year: Data through Q3 2025 (Sept 30). Full-year totals not yet available.
CL

Chia-Li Lin

TSMC: 1 patents #2,025 of 3,957Top 55%
📍 Tainan, TW: #286 of 764 inventorsTop 40%
Overall (2025): #425,195 of 469,880Top 95%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12300644 Die bonding pads and methods of forming the same Wen-Hsiung Lu, Ming-Da Cheng, Yu-Chih Huang, Chen-Shien Chen 2025-05-13