Issued Patents 2025
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412857 | Hybrid micro-bump integration with redistribution layer | Ting-Li Yang, Po-Hao Tsai, Sheng-Pin Yang, Hao-Chun Liu | 2025-09-09 |
| 12388028 | Package structure | Shin-Puu Jeng, Shih-Ting Hung, Po-Yao Chuang | 2025-08-12 |
| 12308313 | Semiconductor package with improved interposer structure | Techi Wong, Po-Hao Tsai, Po-Yao Chuang, Shih-Ting Hung, Shin-Puu Jeng | 2025-05-20 |
| 12308322 | Dual-sided routing in 3D semiconductor system-in-package structure and methods of forming the same | Po-Hao Tsai, Po-Yao Chuang, Meng-Liang Lin, Shin-Puu Jeng, Techi Wong | 2025-05-20 |
| 12300598 | Package structure and method of fabricating the same | Hung-Jui Kuo, Ming-Che Ho | 2025-05-13 |
| 12237262 | Semiconductor package with improved interposer structure | Techi Wong, Po-Hao Tsai, Po-Yao Chuang, Shih-Ting Hung, Shin-Puu Jeng | 2025-02-25 |