Issued Patents 2025
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347791 | Integrated circuit package and method | Chen-Hua Yu, Tzu-Yun Huang, Hung-Jui Kuo | 2025-07-01 |
| 12341072 | Manufacturing method of semiconductor package | Shih-Hao Tseng, Hung-Jui Kuo | 2025-06-24 |
| 12322682 | Semiconductor package having composite seed-barrier layer and method of forming the same | Wei-Chung Chang, Hung-Jui Kuo | 2025-06-03 |
| 12300598 | Package structure and method of fabricating the same | Yi-Wen Wu, Hung-Jui Kuo | 2025-05-13 |
| 12288729 | Integrated circuit package and method | Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai +2 more | 2025-04-29 |
| 12191203 | Semiconductor package | Wei-Chung Chang, Hung-Jui Kuo | 2025-01-07 |