Issued Patents 2025
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406941 | Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the same | Yi-Che Chiang, Chien-Hsun Chen, Tuan-Yu Hung, Hsin-Yu Pan, Wei-Kang Hsieh +8 more | 2025-09-02 |
| 12388041 | Semiconductor package | Kris Lipu Chuang, Hsiu-Jen Lin, Hsin-Yu Pan | 2025-08-12 |
| 12374627 | Method of fabricating semiconductor structure | Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hui-Jung Tsai, Hung-Yi Kuo, Hao-Yi Tsai +4 more | 2025-07-29 |
| 12362270 | Package structure and method of fabricating the same | Kris Lipu Chuang, Chih-Wei Lin, Yu-Fu Chen, Hsin-Yu Pan, Hao-Yi Tsai | 2025-07-15 |
| 12362329 | Method of fabricating semiconductor package | Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Hui-Chun Chiang, Ming Hung Tseng +4 more | 2025-07-15 |
| 12288729 | Integrated circuit package and method | Ming Hung Tseng, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai, Chung-Shi Liu +2 more | 2025-04-29 |
| 12266639 | Method of fabricating semiconductor package | Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Hui-Chun Chiang, Ming Hung Tseng +4 more | 2025-04-01 |
| 12261092 | Semiconductor package and manufacturing method thereof | Ming Hung Tseng, Yen-Liang Lin, Ban-Li Wu, Hsiu-Jen Lin, Teng-Yuan Lo +1 more | 2025-03-25 |
| 12255184 | Semiconductor packages and methods of forming the same | Chen-Hua Yu, Ming Hung Tseng, Yen-Liang Lin, Tin-Hao Kuo, Hao-Yi Tsai | 2025-03-18 |