Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12418005 | Semiconductor package and manufacturing method thereof | Tzuan-Horng Liu, Hao-Yi Tsai, Hsin-Yu Pan | 2025-09-16 |
| 12388041 | Semiconductor package | Hsiu-Jen Lin, Tzu-Sung Huang, Hsin-Yu Pan | 2025-08-12 |
| 12362270 | Package structure and method of fabricating the same | Tzu-Sung Huang, Chih-Wei Lin, Yu-Fu Chen, Hsin-Yu Pan, Hao-Yi Tsai | 2025-07-15 |
| 12362329 | Method of fabricating semiconductor package | Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Hui-Chun Chiang, Tzu-Sung Huang +4 more | 2025-07-15 |
| 12266639 | Method of fabricating semiconductor package | Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Hui-Chun Chiang, Tzu-Sung Huang +4 more | 2025-04-01 |