Issued Patents 2025
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12418005 | Semiconductor package and manufacturing method thereof | Hao-Yi Tsai, Kris Lipu Chuang, Hsin-Yu Pan | 2025-09-16 |
| 12406965 | Package | Ming-Fa Chen, Chao-Wen Shih, Hsien-Wei Chen, Sung-Feng Yeh | 2025-09-02 |
| 12362178 | Method for fabricating a chip package | Jie Chen, Hsien-Wei Chen, Ying-Ju Chen | 2025-07-15 |
| 12362329 | Method of fabricating semiconductor package | Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Hui-Chun Chiang, Tzu-Sung Huang +4 more | 2025-07-15 |
| 12355008 | Methods of fabricating package structure | Ming-Fa Chen, Chao-Wen Shih, Min-Chien Hsiao, Nien-Fang Wu, Sung-Feng Yeh | 2025-07-08 |
| 12300563 | Semiconductor package and method of fabricating the same | Hao-Yi Tsai | 2025-05-13 |
| 12288752 | Semiconductor packages | Ming-Fa Chen, Nien-Fang Wu, Sung-Feng Yeh, Chao-Wen Shih | 2025-04-29 |
| 12272674 | Stacking structure, package structure and method of fabricating the same | Ming-Fa Chen, Sung-Feng Yeh, Chao-Wen Shih | 2025-04-08 |
| 12266639 | Method of fabricating semiconductor package | Hao-Yi Tsai, Cheng-Chieh Hsieh, Tsung-Hsien Chiang, Hui-Chun Chiang, Tzu-Sung Huang +4 more | 2025-04-01 |
| 12224265 | Three-dimensional stacking structure and manufacturing method thereof | Ming-Fa Chen, Sung-Feng Yeh, Chao-Wen Shih | 2025-02-11 |
| 12199024 | Semiconductor device and method of manufacture | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen | 2025-01-14 |