Issued Patents 2025
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406965 | Package | Ming-Fa Chen, Hsien-Wei Chen, Sung-Feng Yeh, Tzuan-Horng Liu | 2025-09-02 |
| 12355008 | Methods of fabricating package structure | Ming-Fa Chen, Min-Chien Hsiao, Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu | 2025-07-08 |
| 12288752 | Semiconductor packages | Ming-Fa Chen, Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu | 2025-04-29 |
| 12272674 | Stacking structure, package structure and method of fabricating the same | Ming-Fa Chen, Sung-Feng Yeh, Tzuan-Horng Liu | 2025-04-08 |
| 12266619 | Integrated devices in semiconductor packages and methods of forming same | Chen-Hua Yu, Kai-Chiang Wu, Chung-Shi Liu, Shou-Zen Chang | 2025-04-01 |
| 12266847 | Semiconductor packages and manufacturing methods thereof | Yung-Ping Chiang, Shou-Zen Chang, Albert Wan, Yu-Sheng Hsieh | 2025-04-01 |
| 12224265 | Three-dimensional stacking structure and manufacturing method thereof | Ming-Fa Chen, Sung-Feng Yeh, Tzuan-Horng Liu | 2025-02-11 |