Issued Patents 2025
Showing 1–25 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412882 | Buffer design for package integration | Jie Chen, Hsien-Wei Chen, Chen-Hua Yu | 2025-09-09 |
| 12412860 | Package structure | Hsien-Wei Chen | 2025-09-09 |
| 12406965 | Package | Chao-Wen Shih, Hsien-Wei Chen, Sung-Feng Yeh, Tzuan-Horng Liu | 2025-09-02 |
| 12394772 | Molded dies in semiconductor packages and methods of forming same | Jie Chen, Hsien-Wei Chen | 2025-08-19 |
| 12388038 | Semiconductor packages including mixed bond types and methods of forming same | — | 2025-08-12 |
| 12368147 | Semiconductor structure having photonic die and electronic die | Hsien-Wei Chen | 2025-07-22 |
| 12362261 | Semiconductor device and method of manufacture | Chih-Chia Hu, Sen-Bor Jan, Hsien-Wei Chen | 2025-07-15 |
| 12362282 | Semiconductor structure and manufacturing method thereof | Ching-Jung Yang, Hsien-Wei Chen | 2025-07-15 |
| 12362326 | Semiconductor package and method of manufacturing semiconductor package | Hsien-Wei Chen | 2025-07-15 |
| 12362342 | Semiconductor package | Jie Chen, Hsien-Wei Chen | 2025-07-15 |
| 12355008 | Methods of fabricating package structure | Chao-Wen Shih, Min-Chien Hsiao, Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu | 2025-07-08 |
| 12353008 | Package, optical device, and manufacturing method of package | Hsien-Wei Chen | 2025-07-08 |
| 12355007 | Package and method of fabricating the same | Hsien-Wei Chen | 2025-07-08 |
| 12345571 | Microelectromechanical infrared sensing device and fabrication method thereof | Chin-Jou Kuo, Bor-Shiun Lee | 2025-07-01 |
| 12334459 | Integrated circuits | Hsien-Wei Chen, Sung-Feng Yeh, Ying-Ju Chen | 2025-06-17 |
| 12315842 | Package structure | Hsien-Wei Chen, Sung-Feng Yeh | 2025-05-27 |
| 12317655 | Semiconductor package and manufacturing method of semiconductor package | Hsien-Wei Chen, Jie Chen | 2025-05-27 |
| 12308298 | Semiconductor die, manufacturing method thereof, and semiconductor package | Jie Chen, Hsien-Wei Chen | 2025-05-20 |
| 12308323 | Package-on-package device | Sung-Feng Yeh, Hsien-Wei Chen | 2025-05-20 |
| 12300639 | Seamless bonding layers in semiconductor packages and methods of forming the same | Chih-Chia Hu | 2025-05-13 |
| 12293985 | Integrated circuit packages and methods of forming the same | Chih-Chia Hu, Sung-Feng Yeh | 2025-05-06 |
| 12288802 | Structure and method for forming integrated high density MIM capacitor | Hsien-Wei Chen, Ying-Ju Chen, Jie Chen | 2025-04-29 |
| 12288752 | Semiconductor packages | Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih | 2025-04-29 |
| 12283570 | Package structure | Hsien-Wei Chen, Sung-Feng Yeh | 2025-04-22 |
| 12283543 | Semiconductor packages | Jie Chen, Hsien-Wei Chen | 2025-04-22 |