Issued Patents 2025
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406965 | Package | Ming-Fa Chen, Chao-Wen Shih, Hsien-Wei Chen, Tzuan-Horng Liu | 2025-09-02 |
| 12362291 | Semiconductor device and method | Kuo-Chiang Ting, Ta Hao Sung, Ming-Zhi Yang, Gao-Long Wu | 2025-07-15 |
| 12355008 | Methods of fabricating package structure | Ming-Fa Chen, Chao-Wen Shih, Min-Chien Hsiao, Nien-Fang Wu, Tzuan-Horng Liu | 2025-07-08 |
| 12334459 | Integrated circuits | Hsien-Wei Chen, Ming-Fa Chen, Ying-Ju Chen | 2025-06-17 |
| 12327815 | Integrated circuit package and method of forming the same | Der-Chyang Yeh, Jian-Wei Hong | 2025-06-10 |
| 12322673 | 3DIC with heat dissipation structure and warpage control | Kuo-Chiang Ting, Ta Hao Sung, Jian-Wei Hong | 2025-06-03 |
| 12315842 | Package structure | Hsien-Wei Chen, Ming-Fa Chen | 2025-05-27 |
| 12308323 | Package-on-package device | Ming-Fa Chen, Hsien-Wei Chen | 2025-05-20 |
| 12293985 | Integrated circuit packages and methods of forming the same | Chih-Chia Hu, Ming-Fa Chen | 2025-05-06 |
| 12288752 | Semiconductor packages | Ming-Fa Chen, Nien-Fang Wu, Tzuan-Horng Liu, Chao-Wen Shih | 2025-04-29 |
| 12283570 | Package structure | Ming-Fa Chen, Hsien-Wei Chen | 2025-04-22 |
| 12272674 | Stacking structure, package structure and method of fabricating the same | Ming-Fa Chen, Tzuan-Horng Liu, Chao-Wen Shih | 2025-04-08 |
| 12272622 | Package and manufacturing method thereof | Ming-Fa Chen, Jian-Wei Hong | 2025-04-08 |
| 12266584 | Integrated circuit package and method | Hsien-Wei Chen, Ming-Fa Chen | 2025-04-01 |
| 12266637 | Die stack structure and manufacturing method thereof | Hsien-Wei Chen, Jie Chen, Ming-Fa Chen, Ying-Ju Chen | 2025-04-01 |
| 12255116 | Semiconductor structure and manufacturing method thereof | Ming-Fa Chen, Ta Hao Sung | 2025-03-18 |
| 12224265 | Three-dimensional stacking structure and manufacturing method thereof | Ming-Fa Chen, Tzuan-Horng Liu, Chao-Wen Shih | 2025-02-11 |
| 12218026 | Package structure for heat dissipation | Chen-Hua Yu, Ming-Fa Chen | 2025-02-04 |
| 12211823 | Semiconductor package with shared barrier layer in redistribution and via and method of manufacturing the same | Hsien-Wei Chen, Ching-Jung Yang, Ming-Fa Chen, Ying-Ju Chen | 2025-01-28 |
| 12205911 | Bonding structure and method of forming same | Ming-Fa Chen, Hsien-Wei Chen, Jie Chen | 2025-01-21 |
| 12199024 | Semiconductor device and method of manufacture | Chen-Hua Yu, Ming-Fa Chen, Hsien-Wei Chen, Tzuan-Horng Liu | 2025-01-14 |